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Grinding and polishing equipment

Fltec-S系列
methods, such as grinding and polishing, have become essential processing technologies to meet the demands of semiconductors, including high integration of various devices, high-precision processing of electronic components, and precision parts.It is no exaggeration to say that this is a super high-precision processing method, particularly used for creating surfaces of compound semiconductors, fine ceramics, and ultra-precision optical components.。 The Flotec-S series grinding and polishing machine is a packaging and polishing machine that overcomes various issues in traditional grinding and polishing processes and challenges areas that require utmost precision.。
Minimum 0.01 mm
Standard Specifications
Equipment Series Fltec-S Series
Wafer Diameter φ380mm（φ610mm）
Wafer Rotation 0-200 RPM (Revolutions Per Minute)
Wafer Cooling Method Constant Temperature Water Circulation Method
Feed Speed of Surface Teeth 0-500 mm/min
Swing Stroke 0 to 30 mm (0 to 45 mm)
Number of Drives 2 Axes/Stepless Speed
Minimum Cutting Amount
Drive Method Belt Drive
Fltec-M系列
- It is a packaging machine used for mass production, primarily for equipment components that require flat surfaces.。 It is used for finishing with uniform surface roughness after material grinding and for planar sliding surfaces of sealing materials.。 Compared to the S series, it has fewer mechanisms, making it a more accessible piece of equipment.。 It is recommended when you want to process a large quantity of fewer varieties of workpieces.。
Standard Specifications
Equipment Series Fltec-24M
Equipment Dimensions 1510Wx1060Dx1237H (mm)
Weight 800公斤
Power Supply AC 200 Three Phase
Main Motor: 1.5 kW
Pump: 0.25 kW
Plate Dimensions Φ610
Correction Ring Diameter 外徑 φ280 x 內徑 φ247 mm
Ring Rotation Natural Revolution
Number of Simultaneous Processing 3 Axes
Table Rotation Speed 0-60 RPM (Revolutions Per Minute)
First Start Slow Start/Slow Stop Mechanism
Powder Feeding Method Auto Fill
Fltec-06
It serves as a compact benchtop device for research and development.。 It is suitable for wafer polishing, sample polishing, and more.。
Standard Specifications
Equipment Dimensions 340Wx220Dx320H (mm)
Wafer Diameter φ150（mm）
Power AC100 Three Phase 5A
Table Rotation Speed 0-80rpm Stepless Speed Control
Processing Time Setting 1-999S
Fltec-15
Desktop equipment for research and development。 It can engage in various research and development activities and offers a wide range of options, even as a desktop unit.。 It cannot handle large workpiece sizes but can perform various polishing tasks.。
Standard Specifications
Equipment Dimensions 650Wx480Dx340H (mm)
Total Size 870Wx700Dx740H (mm)
Weight About 100 kg（Including PVC cover plate）
Plate Weight Approximately 15 kg
Wafer Size φ380 (mm)
Maximum Diameter of Polishing Samples φ180（mm）
Power AC200 Three Phase10A
Table Rotation Speed 0 to 70 RPM (Revolutions Per Minute)
Table Rotation Speed Setting Volume Setting Digital Display
Processing Time Setting From 1 second (minimum) to 9999 hours (maximum)
Fltec-15SP
It can engage in various research and development activities and offers a wide range of options, even as a desktop unit.。 Specially designed for specifications in clean rooms.。 It can also be used in conjunction with our laboratory. It cannot handle large workpiece sizes but can perform various polishing tasks.。
Standard Specifications
Equipment Dimensions 650Wx480Dx340H (mm)
Plate Dimensions 870Wx700D (mm)
Weight Approximately 150 kg (including the plate)
Plate Weight Approximately 30 kg (including the plate)
Surface Size φ380（mm）
Maximum Diameter of Polishing Samples φ180（mm）
Power AC200 three Phase 10A
Table Rotation Speed 0 to 70 RPM (Revolutions Per Minute)
Table Rotation Speed Setting Volume Setting Digital Display
Processing Time Setting From 1 second (minimum) to 9999 hours (maximum)
Surface Groove Cutting Equipment
Mainly designed to be installed as a cutting device (mechanism) in the S series.）。 When used in conjunction with the S series water-cooled precision spindle, it can maintain the flatness of the polishing plate. Please install it when using resin substrates or metal plates.。