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Various Materials Provided

Various Materials Provided

In addition to silicon wafers, we also handle various chips such as silicon carbide, gallium nitride, gallium arsenide, and glass。

Wafer Boxes
We handle wafer boxes of various sizes。
We have a box that accommodates 25 pieces of paper, a single sheet box, and a protoss box for holding thin processed wafers。
Various Wafer Specifications
Product Name Size Thickness (micrometers)
SiC( Silicon Carbide) Φ2~
6英寸
330/350/430
SiO2(Quartz) Φ1~
6英寸
100-50,000
GaAs(Gallium Arsenide) Φ2~
6英寸
350-675
GaP(Gallium Phosphide) Φ2~
3英寸
250-1000
InAs(Indium Arsenide) Φ2~
3英寸
500,625
InP(Indium Phosphate) Φ2-4
英寸
350-675
Al2O3(Sapphire) Φ1~
8英寸
150-3000
ZnO(Zinc Oxide) 10-20mm_
_
500/1000
LiNbO3(Lithium Niobate) Φ2~
6英寸
250-500
LiTaO3(Lithium Tantalate) Φ2~
6英寸
250-500