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Wafer Processing

We process from chip sizes to φ300mm 。

We shape them into the required forms such as thinning, mirror finishing, film formation, and cutting。

Polishing / Grinding / Cutting
Packaging, polishing, and CMP for polishing.。
Grinder polishing。
Cutting using slicing and chunking。
We process to meet all shapes and required precision 。
Film Processing
In addition to shape processing, we also accept film processing。
Various types of thin films can be formed。
Types Manufacturing Methods Film-type
氧化膜系統 hermal Oxide Film Thin Thermal Oxide Film
Ultra-thick Thermal Oxide Film
Low-Pressure Chemical Vapor Deposition LP-SiO2、HTO、LP-TEOS
PE-CVD PE-SiO2、PE-TEOS、HDP、Low-k（BD、BDⅡ、AURORA、CORAL）、PSG、NSG、BPSG
Spin Coating Sog
Annealing Furnace RTO
Nitride Film System Low-Pressure Chemical Vapor Deposition LP-SiN
PE-CVD PE-SiN
Si Film Low-Pressure Chemical Vapor Deposition Polycrystalline Silicon
Polycrystalline Silicon/font>
Organic Film System Spin Coating G-line Photoresist, I-line Photoresist, KrF Photoresist, ArF Photoresist, Polyimide (photosensitive, non-photosensitive)
Metal Type Sputtering Al、Al-Si、Al-Si-Cu、Al-Cu、Ti、TiN、Ta、TaN、Cr、Cu、W、Ni、Au、Pt、ITO等
Electroplating Titanium, Nickel, Gold, Copper, etc
Chemical Vapor Deposition Tungsten Silicon
Reclamation
We accept reclamation of Silicon and SiC wafers 。 If you use a large number of wafers, please consider doing it at once / Play Type。
Play Type Reclaimable Film Species Size Minimum Quantity
Polishing Reclamation Excluding precious metals like Gold, Copper, Platinum, etc φ3”to φ8” 25 sheets
Chemical Reclamation Excluding precious metals like Gold, Copper, Platinum, etc φ3”to φ8” 25 sheets
* For reclamation, it's easier to achieve cost advantages if the number of wafers is large rather than small。